Preparation, Deposition and IntegrationIon etching, Annealing, Cleaving, Molecular Beam Epitaxy, Physical Vapour Deposition, Pulsed Laser Deposition and System Integration.
In oder to obtain relevant results by cutting edge characterization methods it require the preparation and deposition of well-defined and clean materials surfaces and interfaces. Classical techniques for surface preparation, like cleaving, sputter cleaning, annealing and reactive heating can be combined by several thin film deposition techniques, like Molecular Beam Epitaxy (MBE), Physical Vapor Depostion (PVD), Pulsed Laser Deposition (PLD). The integration of third party preparation and deposition techniques is possible. For vacuum or inert-gas integration several distribution systems (linear and radial distribution chambers or chamber-to.chamber integration) are available. SPECS also offers more advanced preparation system satellites, like high pressure cells and electrochemical cells, to also address the challenges of applied materials research.